ADM1270ACPZ-R2 datasheet(5/21 Pages) AD

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Data Sheet

ADM1270

Rev. A | Page 5 of 21

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VCC/SENSE+

−0.3 V to +66 V

VCAP

−0.3 V to +6 V

ISET

−0.3 V to VCAP + 0.3 V

FLB

−0.3 V to +6 V

FB_PG

−0.3 V to +6 V

TIMER_OFF

−0.3 V to VCAP + 0.3 V

TIMER

−0.3 V to VCAP + 0.3 V

FAULT

−0.3 V to +6 V

ENABLE

−0.3 V to +6 V

PWRGD

−0.3 V to +66 V

GATE

−0.3 V to VCC + 0.3 V

GATE to VCC/SENSE+

−22 V to +0.3 V

SENSE−

−0.3 V to VCC + 0.3 V

RPFG

−0.3 V to VCC + 0.3 V

RPFG to VCC/SENSE+

−22 V to +0.3 V

VSENSE (VSENSE+ − VSENSE−)

±0.3 V

Continuous Current into Any Pin

±10 mA

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +125°C

Lead Temperature, Soldering (10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL CHARACTERISTICS

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

θJC

ΨJB

Unit

16-Lead, 3 mm × 3 mm LFCSP

49.5

35.2

29.6

°C/W

16-Lead QSOP

106.03

28.31

43.22

°C/W

ESD CAUTION

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