7

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R08

CPC1967

4.5 Mechanical Dimensions

DCB Substrate

1.270 TYP

(0.050 TYP)

NOTE: Metallized external surface of DCB substrate maintains 2500V

rms

isolation to device internal structure and all external pins.

20.879 ± 0.254

(0.822 ± 0.010)

20.396 ± 0.508

(0.803 ± 0.020)

15.240 ± 0.508

(0.600 ± 0.020)

3.810 ± 0.254

(0.150 ± 0.010)

2.362 ± 0.381

(0.093 ± 0.015)

19.914 ± 0.254

(0.784 ± 0.010)

5.029 ± 0.127

(0.198 ± 0.005)

1.181 ± 0.076

(0.047 ± 0.003)

15.317 ± 0.254

(0.603 ± 0.010)

1.930 ± 0.381

(0.076 ± 0.015)

17.221 ± 0.254

(0.678 ± 0.010)

DIMENSIONS

mm

(inches)

0.635 ± 0.076

(0.025 ± 0.003)

2.794 ± 0.127

(0.110 ± 0.005)

NOTE: Not to be soldered

For additional information please visit our website at: www.ixysic.com

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated

Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its

products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe

property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC1967-R08

©Copyright 2015, IXYS Integrated Circuits Division

All rights reserved. Printed in USA.

3/9/2015