IX2127 datasheet(12/13 Pages) IXYS

12 / 13 page

INTEGRATED CIRCUITS DIVISION

IX2127

www.ixysic.com

R03

3.5 Mechanical Dimensions

3.5.1 8-Pin DIP Through-Hole Package

3.5.2 8-Pin SOIC Package

Dimensions

(inches)

PCB Hole Pattern

2.540 ± 0.127

(0.100 ± 0.005)

6.350 ± 0.127

(0.250 ± 0.005)

9.144 ± 0.508

(0.360 ± 0.020)

0.457 ± 0.076

(0.018 ± 0.003)

9.652 ± 0.381

(0.380 ± 0.015)

7.239 TYP.

(0.285)

7.620 ± 0.254

(0.300 ± 0.010)

4.064 TYP

(0.160)

0.813 ± 0.102

(0.032 ± 0.004)

8-0.800 DIA.

(8-0.031 DIA.)

2.540 ± 0.127

(0.100 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

6.350 ± 0.127

(0.250 ± 0.005)

3.302 ± 0.051

(0.130 ± 0.002)

Pin 1

0.254 ± 0.0127

(0.010 ± 0.0005)

Dimensions

(inches)

PCB Land Pattern

Pin 1

Pin 8

3.937 ± 0.254

(0.155 ± 0.010)

5.994 ± 0.254

(0.236 ± 0.010)

0.406 ± 0.076

(0.016 ± 0.003)

4.928 ± 0.254

(0.194 ± 0.010)

1.270 REF

(0.050)

1.346 ± 0.076

(0.053 ± 0.003)

0.051 MIN - 0.254 MAX

(0.002 MIN - 0.010 MAX)

0.559 ± 0.254

(0.022 ± 0.010)

0.762 ± 0.254

(0.030 ± 0.010)

1.27

(0.050)

5.40

(0.213)

1.55

(0.061)

0.60

(0.024)

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