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LM317S/NOPB Arkusz danych(PDF) 32 Page - Texas Instruments |
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LM317S/NOPB Arkusz danych(HTML) 32 Page - Texas Instruments |
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32 / 48 page ![]() LM117, LM317-N SNVS774P – MAY 2004 – REVISED OCTOBER 2015 www.ti.com Thermal Considerations (continued) Table 2. θJA Different Heatsink Area LAYOUT COPPER AREA THERMAL RESISTANCE Top Side (in2)(1) Bottom Side (in2) ( θJA°C/W) TO-252 1 0.0123 0 103 2 0.066 0 87 3 0.3 0 60 4 0.53 0 54 5 0.76 0 52 6 1.0 0 47 7 0.066 0.2 84 8 0.066 0.4 70 9 0.066 0.6 63 10 0.066 0.8 57 11 0.066 1.0 57 12 0.066 0.066 89 13 0.175 0.175 72 14 0.284 0.284 61 15 0.392 0.392 55 16 0.5 0.5 53 (1) Tab of device attached to topside of copper. Figure 43. θJA vs 2-oz. Copper Area for TO-252 Figure 44. Maximum Allowable Power Dissipation vs Ambient Temperature for TO-252 32 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N |
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