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P4C1024 Arkusz danych(PDF) 8 Page - Pyramid Semiconductor Corporation

Numer części P4C1024
Szczegółowy opis  HIGH SPEED 128K X 8 CMOS STATIC RAM
PDF  8 Pages
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Producent  PYRAMID [Pyramid Semiconductor Corporation]
Strona internetowa  http://www.pyramidsemiconductor.com
Logo PYRAMID - Pyramid Semiconductor Corporation

P4C1024 Arkusz danych(HTML) 8 Page - Pyramid Semiconductor Corporation

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P4C1024
Page 8 of 14
Document # SRAM124 REV A
ORDERING INFORMATION
SELECTION GUIDE
The P4C1024 is available in the following temperature, speed and package options.
15
20
25
35
45
Plastic DIP (300 mil)
-15P3C
-20P3C
-25P3C
-35P3C
N/A
Plastic SOJ (300 mil)
-15J3C
-20J3C
-25J3C
-35J3C
N/A
Plastic SOJ (400 mil)
-15J4C
-20J4C
-25J4C
-35J4C
N/A
Plastic DIP (300 mil)
N/A
-20P3I
-25P3I
-35P3I
-45P3I
Plastic SOJ (300 mil)
N/A
-20J3I
-25J3I
-35J3I
-45J3I
Plastic SOJ (400 mil)
N/A
-20J4I
-25J4I
-35J4I
-45J4I
Ceramic DIP (600 mil)
N/A
-20C6M
-25C6M
-35C6M
-45C6M
Ceramic DIP (400 mil)
N/A
-20C4M
-25C4M
-35C4M
-45C4M
Solder Seal Flatpack
N/A
-20FSM
-25FSM
-35FSM
-45FSM
LCC (450 x 550 mil)
N/A
-20LM
-25LM
-35LM
-45LM
Ceramic SOJ
N/A
-20CJM
-25CJM
-35CJM
-45CJM
Ceramic DIP (600 mil)
N/A
-20C6MB
-25C6MB
-35C6MB
-45C6MB
Ceramic DIP (400 mil)
N/A
-20C4MB
-25C4MB
-35C4MB
-45C4MB
Solder Seal Flatpack
N/A
-20FSMB
-25FSMB
-35FSMB
-45FSMB
LCC (450 x 550 mil)
N/A
-20LMB
-25LMB
-35LMB
-45LMB
Ceramic SOJ
N/A
-20CJMB
-25CJMB
-35CJMB
-45CJMB
Military
Processed*
Commercial
Speed
Military
Temperature
Tempera ture
Range
Package
Industrial
* Military temperature range with MIL-STD-883, Class B compliance.
N/A = Not Available



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