OPA569

SBOS264A

2

www.ti.com

PIN #

NAME

DESCRIPTION

1, 10, 11, 20

PowerPAD

PowerPAD Connection Pins

2

Parallel Out 1

Connection for Paralleling Multiple

Amplifiers

3

Current Limit Set

Current Limit Set Pin

4

Current Limit Flag

Indicates When Part is in Current

Limit (Active LOW).

5

–In

Inverting Input

6

+In

Noninverting Input

7

Thermal Flag

Indicates Thermal Stress (Active

LOW)

8

Enable

Enabled HIGH. Shut down LOW.

9

Parallel Out 2

Connection for Paralleling Multiple

Amplifiers

12, 13

V+

Positive Power-Supply Voltage

14, 15

Output

16

NC

No Internal Connection

17, 18

V–

Negative Power-Supply Voltage

19

Provides 1:475 Bidirectional Copy

of Output Current.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper han-

dling and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.

Supply Voltage ................................................................................. +7.5V

Output Current ............................................................... See SOA Curves

Signal Input Terminals (pins 2, 5, 6, and 9):

±10mA

Current Monitor (pin 19) Short-Circuit ..................................... Continuous

Enable Pin (pin 8) .......................................... (V–) – 0.5V to (V–) + 7.5V

PowerPAD (pins 1, 10, 11, 20, and pad) ...... (V–) – 0.5V to (V–) + 0.5V

Current Limit Set (pin 3) ................................. (V–) – 0.5V to (V+) + 0.5V

Operating Temperature .................................................. –55

°C to +125°C

Storage Temperature ..................................................... –65

°C to +150°C

Junction Temperature .................................................................... +150

°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

NOTE: (1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods may de-

grade device reliability. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those specified is

not implied. (2) Input terminals are diode-clamped to the power-supply rails.

Input signals that can swing more than 0.5V beyond the supply rails should

be current limited to 10mA or less. (3) Short-circuit to ground.

PIN CONFIGURATION

PACKAGE/ORDERING INFORMATION

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

Parallel Out 1

Current Limit Set

Current Limit Flag

–In

+In

Thermal Flag

Enable

Parallel Out 2

I

MONITOR

V

O

(3)

V

O

(3)

OPA569

Metal

PowerPAD

Heat Sink

(Located

on

bottom

side)

NOTES: (1) PowerPAD pins 1, 10, 11, and 20 and the

PowerPAD should be connected to the most negative

supply (V–) in either single or split supply configurations.

(2) NC means no internal connection.

(3) The following pin pairs must be connected together:

12 and 13; 14 and 15; 17 and 18.

Top View

SO

PIN DESCRIPTIONS

For the most current package and ordering information, see

the Package Option Addendum located at the end of this

data sheet.