VCNL4100

www.vishay.com

Vishay Semiconductors

Rev. 1.2, 30-Aug-16

15

Document Number: 84319

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

RECOMMENDED INFRARED REFLOW

Soldering conditions which are based on J-STD-020 C.



Recommend Normal Solder Reflow is 235 °C to 255 °C.

Fig. 15 - VCNL4100 Solder Reflow Profile Chart

RECOMMENDED IRON TIP SOLDERING CONDITION AND WARNING HANDLING

1. Solder the device with the following conditions:

1.1. Soldering temperature: 400 °C (max.)

1.2. Soldering time: 3 s (max.)

2. If the temperature of the method portion rises in addition to the residual stress between the leads, the possibility that an

open or short circuit occurs due to the deformation or destruction of the resin increases.

3. The following methods: VPS and wave soldering, have not been suggested for the component assembly.

4. Cleaning method conditions:

4.1. Solvent: methyl alcohol, ethyl alcohol, isopropyl alcohol

4.2. Solvent temperature < 45 °C (max.)

4.3. Time: 3 minutes (min.)

IR REFLOW PROFILE CONDITION

PARAMETER

CONDITIONS

TEMPERATURE

TIME

Peak temperature

255 °C + 0 °C / - 5 °C (max.: 260 °C)

10 s

Preheat temperature range and timing

150 °C to 200 °C

60 s to 180 s

Timing within 5 °C to peak temperature

10 s to 30 s

Timing maintained above temperature / time

217 °C

60 s to 150 s

Timing from 25 °C to peak temperature

8 min (max.)

Ramp-up rate

3 °C/s (max.)

Ramp-down rate

6 °C/s (max.)

200

150

217

255

Max. Temperature

(260 °C + 0 °C / - 5 °C)/10 s

Soldering Zone

60 s to 150 s

Time (s)

t

2

t

1

Ramp-Down Rate

6 °C/s (max.)

Pre-Heating Time

t

Ramp-Up Rate

3 °C/s (max.)

Ramp-Up Rate

3 °C/s (max.)