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UCD3138ARMHT Arkusz danych(PDF) 84 Page - Texas Instruments |
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UCD3138ARMHT Arkusz danych(HTML) 84 Page - Texas Instruments |
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84 / 87 page ![]() www.ti.com PACKAGE OUTLINE C 40X 0.30 0.18 4.15 0.1 40X 0.5 0.3 1 MAX (0.2) TYP 0.05 0.00 2X 4.5 36X 0.5 2X 4.5 4X ( 0.32) 2.74 TYP 2.74 TYP A 6.1 5.9 B 6.1 5.9 VQFN - 1 mm max height RJA0040A PLASTIC QUAD FLATPACK - NO LEAD 4222901/A 05/2016 PIN 1 INDEX AREA 0.08 SEATING PLANE 1 10 21 30 11 20 40 31 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD A1 A2 A3 A4 41 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 2.000 |
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