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MIC28303 Arkusz danych(PDF) 6 Page - Microchip Technology |
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MIC28303 Arkusz danych(HTML) 6 Page - Microchip Technology |
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6 / 38 page ![]() MIC28303 DS20005464A-page 6 2016 Microchip Technology Inc. TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Junction Operating Temperature TJ –40 — +125 °C Note 1 Storage Temperature Range TS –65 — +150 °C — Junction Temperature TJ — — +150 °C — Lead Temperature — — — +260 °C Soldering, 10s Package Thermal Resistances Thermal Resistance 12 mm x 12 mm QFN-64LD JA —20 — °C/W — JC —5 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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