Micrel, Inc.

MICRF507

October 2, 2013

3

Revision 2.2

Bill of Materials................................................................................................................................................................. 36

Layout Considerations .................................................................................................................................................... 37

Layer Definition ..................................................................................................................................................... 37

Grounding.............................................................................................................................................................. 37

RF Traces.............................................................................................................................................................. 37

Supply Routing ...................................................................................................................................................... 37

PLL Loop Filter ...................................................................................................................................................... 37

Overview of Programming Bits....................................................................................................................................... 38

Detailed Description of Programming Bits.................................................................................................................... 39

Package Information and Recommended Landing Pattern ......................................................................................... 46