SAW FILTER

HDF460F SMD-3

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3. TEST CIRCUIT

4. DIMENSION

5. ENVIRONMENTAL CHARACTERISTICS

5-1 High temperature exposure

Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions

for 24 hours prior to the measurement. It shall fulfill the specifications in table 1.

5-2 Low temperature exposure

Subject the device to -20℃ for 16 hours. Then release the device into the room conditions

for 24 hours prior to the measurement. It shall fulfill the specifications in table 1.

5-3 Temperature cycling

Subject the device to a low temperature of -40℃for 30 minutes. Following by a high

temperature of +80℃ for 30 Minutes. Then release the device into the room conditions

for 24 hours prior to the measurement. It shall meet the specifications in table 1.

5-4 Resistance to solder heat

Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for

10±1 sec. Then release the device into the room conditions for 4 hours. The device shall

meet the specifications in table 1.

5-5 Solderability

Subject the device terminals into the solder bath at 245℃±5℃ for 5s, More than 95%

2. Input/Outout

1.3. Ground

6.Output/Input

5.7.Ground

4.8. Ground