BSP372N datasheet(2/9 Pages) INFINEON

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BSP372N

Parameter

Symbol Conditions

Unit

min.

typ.

max.

Thermal characteristics

Thermal resistance

junction - soldering point

R thJS

K/W

Thermal resistance

R thJA

minimal footprint

110

junction - ambient

6 cm

2 cooling area1)

Electrical characteristics, at T j=25 °C, unless otherwise specified

Static characteristics

Drain-source breakdown voltage

V (BR)DSS V GS=0 V, I D=250 µA

100

Gate threshold voltage

V GS(th)

V DS=Vgs V, I D=218 µA

0.8

1.4

1.80

Drain-source leakage current

I DSS

V DS=100 V, V GS=0 V,

T j=25 °C

0.1

V DS=100 V, V GS=0 V,

T j=150 °C

Gate-source leakage current

I GSS

V GS=20 V, V DS=0 V

Gate-source on-state resistance

RDS(on)

V GS=10 V, I D=1.8 A

153

230

V GS=4.5 V, I D=1.7 A

172

270

Transconductance

g fs

|V DS|>2|I D|R DS(on)max,

I D=1.5 A

5.1

Values

1) Device on 40mm x 40mm x 1.5mm epoxy PCB FR4 with 6cm² (one layer, 70µm thick) copper area for drain

connection. PCB is vertical in still air.

Rev 2.0

page 2

2013-04-03

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