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STSPIN230 Arkusz danych(PDF) 16 Page - STMicroelectronics |
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STSPIN230 Arkusz danych(HTML) 16 Page - STMicroelectronics |
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16 / 22 page ![]() Functional description STSPIN230 16/22 DocID029312 Rev 4 6.4 Thermal shutdown The device embeds circuitry protecting it from the overtemperature condition. When the thermal shutdown temperature is reached the power stage is disabled and the EN\FAULT input is forced low through the integrated open-drain MOSFET (refer to Figure 7). The protection and the EN\FAULT output are released when the IC temperature returns below a safe operating value (TjSD - TjSD,Hyst). Figure 7. Thermal shutdown management |
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