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164

characteristics

csM series

Board Mount Heat Sink

For TO-220 Devices

Heatsink

Surface Area

Weight

Length L

Thermal

Part Number

(oz / g)

(mm) Res.* (°C/W)

CSM221-12AE

1.84 / 1,188

0.13/ 3.7

12

18.0

CSM221-28AE

4.30 / 2,772

0.3 / 8.5

28

12.8

CSM221-40AE

6.14 / 3,960 0.43 / 12.2

40

12.1

CSM222-30AE

6.25 / 4,029

0.5 / 14.2

30

11.3

CSM223-50AE

10.30 / 6,645 0.6 / 17.0

50

9.8

*Free convection at 10 watts dissipation

series s P eci F icati ON s

Heat Dissipation

Heat dissipation is the total for ALL DEVICES attached to

the heat sink

(continued)

600

400

500

900

700

800

Heat Dissipated (watts)

4

2

0

10

8

6

12

14

300

1000

Air Velocity (ft./min.)

CSM221-12AE

CSM221-28AE

CSM221-40AE

0

15

30

45

60

75

90

150

135

105

120

0

1

2

3

4

5

6

7

8

9

10

600

400

500

900

700

800

Heat Dissipated (watts)

4

2

0

10

8

6

12

14

300

1000

Air Velocity (ft./min.)

CSM222-30AE

CSM223-50AE

0

15

30

45

60

75

90

150

135

105

120

0

1

2

3

4

5

6

7

8

9

10

Heat Sink

Aluminum Alloy 6063-T5 or Equivalent

with either degreased or black anodized

finish.

Solder Foot

Cold-rolled Steel, surface tin plated.

Interface

Thermal

Resistance

for improvement, use thermal joint com-

pound, 0.005 Grafoil (TGon 800 by Laird),

or phase change material (Hi-Flow by

Bergquist)

Insulato

r (Optional) Sil-Pad 900-S, K6 800-S and

K10 by Bergquist

The economically priced CSM Series is suitable for

use with TO-220 devices found in active components

as well as power resistors. With surface areas rang-

ing from 1188 Sq. mm to 6645 Sq. mm, the CSM

family comes in 5 configurations, all of them with

Black Anodized surface treatment. These heatsinks

offer a range of thermal performance from 18.0 to

9.8 C/W. Each device offers solder able mounting

feet and anywhere from 1, 2 or 3 mounting holes are

available for convenient device attachment.