Model

SFN08

0.4

Nichrome Resistor Networks

on Silicon Substrates

SFN08A, SFN08B Series

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General Note

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All information is subject to TT electronics’ own data and is considered accurate at time of going to print.

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01. 12

Package Power And Derating Curve

Thermal Shock plus Power Conditioning

ΔR 0.25%

Short Time Overload

ΔR 0.1%

Terminal Strength

ΔR 0.1%

Moisture Resistance

ΔR 0.2%

Mechanical Shock

ΔR 0.25%

Vibration

ΔR 0.25%

Low Temperature Operation

ΔR 0.05%

High Temperature Exposure

ΔR 0.1%

Resistance to Solder Heat

ΔR 0.1%

Marking Permanency

Per MIL-STD-202, Method 215

Flammability

UL-94V-0 Rated

Storage Temperature Range

-55°C to +125°C

Environmental (MIL-R-83401)

Pad Plating

100 matte Tin (RoHS compliant)

Pad Material

Copper Alloy

Pad Coplanarity

0.003” (0.08 mm)

Substrate Material

Silicon

Resistor Material

Passivated Nichrome

Body Material

Molded Epoxy

Mechanical

4 Maximum power per resistor @ 70C is 100 mW, not to exceed package power

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