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LM4835 Arkusz danych(PDF) 5 Page - National Semiconductor (TI) |
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LM4835 Arkusz danych(HTML) 5 Page - National Semiconductor (TI) |
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5 / 16 page ![]() Typical Performance Characteristics MTE Specific Characteristics Note 17: These curves show the thermal dissipation ability of the LM4835MTE at different ambient temperatures given these conditions: 500LFPM + 2in2: The part is soldered to a 2in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it. 2in2on bottom: The part is soldered to a 2in2, 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias. 2in2: The part is soldered to a 2in2, 1oz. copper plane. 1in2: The part is soldered to a 1in2, 1oz. copper plane. Not Attached: The part is not soldered down and is not forced-air cooled. Non-MTE Specific Characteristics LM4835MTE THD+N vs Output Power DS100139-70 LM4835MTE THD+N vs Frequency DS100139-71 LM4835MTE THD+N vs Output Power DS100139-72 LM4835MTE THD+N vs Frequency DS100139-73 LM4835MTE Power Dissipation vs Output Power DS100139-65 LM4835MTE(Note 17) Power Derating Curve DS100139-64 THD+N vs Frequency DS100139-57 THD+N vs Frequency DS100139-58 www.national.com 5 |
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