AS7262 datasheet(38/47 Pages) AMSCO

Numer części	AS7262

Szczegółowy opis	6 visible channels: 450nm, 500nm, 550nm, 570nm, 600nm and 650nm, each with 40nm FWHM

PDF	47 Pages

Scroll/Zoom	100%

Producent	AMSCO [ams AG]

Strona internetowa	http://www.ams.com

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38 / 47 page

Page 38

ams Datasheet

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[v1-00] 2016-Dec-16

AS7262 − Soldering & Storage Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The solder reflow

profile describes the expected maximum heat exposure of

components during the solder reflow process of product on a

PCB. Temperature is measured on top of component. The

components should be limited to a maximum of three passes

through this solder reflow profile.

Figure 37:

Solder Reflow Profile

Figure 38:

Solder Reflow Profile Graph

Parameter

Reference

Device

Average temperature gradient in preheating

2.5°C/s

Soak time

tSOAK

2 to 3 minutes

Time above 217°C(T1)t1

Max 60s

Time above 230°C(T2)t2

Max 50s

Time above Tpeak - 10°C(T3)t3

Max 10s

Peak temperature in reflow

Tpeak

260°C

Temperature gradient in cooling

Max -5°C/s

Soldering & Storage

Information

AS7262 Arkusz danych(PDF) 38 Page - ams AG