E

D

e

1.50

6.40

12.00

b

0.25 C A B

0.10

SEE NOTE 3

0.20

A

0.10

A

A

A1

DETAIL A

SCALE 6 : 1

0.20 C

0.20 C

C

1. Dimensions are in millimeters.

2. Interpret dimensions and tolerances per ASME Y14.5M-1994.

3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane C.

4. Datum C (seating plane) is defined by the spherical crowns of the solder balls.

5. Parallelism measurement shall exclude any effect of mark on top surface of package.

Ironwood Package Code: BGA96G

DIM

Minimum Maximum

A

1.0

1.2

A1

0.29

0.39

b

0.50

D

9.00 BSC

E

13.0 BSC

e

0.8 BSC

ARRAY

9 X 16

PIN COUNT

96

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance

±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Compatible BGA

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Approval Pending

REV. C.03

DATE: 9/7/2012

Material: Material <not specified>

Finish:

Weight: 13.66

CBT-BGA-6018 Drawing

SCALE: 7:1

SHEET: 3 OF 5

ENG: V. Panavala

FILE: CBT-BGA-6018

DRAWN BY: V. Panavala