AD8222HACPZ-R7 datasheet(23/25 Pages) AD

23 / 25 page

AD8222

Data Sheet

Rev. B | Page 22 of 24

OUTLINE DIMENSIONS

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGC.

0.65

BSC

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

0.50

0.40

0.30

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

0.35

0.30

0.25

2.60

2.50 SQ

2.40

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 55. 16-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-16-26)

Dimensions are shown in millimeters

COMPLIANT

TO JEDEC STANDARDS MO-263-VBBC

0.65

BSC

1.95 REF

0.75

0.60

0.50

TOP VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

COPLANARITY

0.08

1.00

0.85

0.80

0.35

0.30

0.25

0.05 MAX

0.02 NOM

0.20 REF

0.60 MAX

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

3.75 BSC

BOTTOM VIEW

Figure 56. 16-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.85 mm Package Height with Hidden Paddle

(CP-16-19)

Dimensions shown in millimeters

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