WS3412HS7P datasheet(6/8 Pages) WINSEMI

6 / 8 page

www.winsemi.com Tel : +86-755-8250 6288

Fax : +86-755-8250 6299

6/8

WS3412H ProductDescription

WINSEMI MICROELECTRONICS

Bypass Capacitor

The bypass capacitor on VCC pin should be as close as

possible to the VCC and GND pins.

Ground Path

The power ground path for current sense resistor should

be short and wide, and it should be as close as possible to the

IC ground (pin 2), otherwise the LED output current accuracy

maybe affected. The IC signal ground for COMP and FB

components should be connected to the IC GND pin with

short traces and should be away from the power ground path.

The Area of Power Loop

The area of main current loop should be as small as

possible to reduce EMI radiation.

FB Pin

The feedback resistor divider should be as close as

possible to the FB pin, and the trace must keeps away from

dynamic node of the inductor (DRAIN pin trace、the positive

pin and the negative pin of Vo trace), otherwise the FB pin

OVP function might have risk to be mis-triggered by the

system noise.

DRAIN Pin

To increase the copper area of DRAIN pin for better

thermal dissipation. However, too large copper area may

compromise EMI performance.

The material of PCB

Avoid choosing the material that is easy to absorb the

moisture, just like paper copper-clad laminates.

WS3412HS7P Arkusz danych(PDF) 6 Page - Shenzhen Winsemi Microelectronics Co., Ltd