Tlam

™ SS HTD03

Thermally Conductive PCB Substrate

(High Temperature)

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THR-DS-Tlam-SS HTD03 1115

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the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. Version A01

Tlam SS HTD03 Typical Values

Thermal Properties

UNITS

Tlam SS HTD03

Thermal Conductivity

W/mK

2.2

Thermal Resistance

°C-in²/W

0.049

Glass Transition Temperature

°C

168

Soldering Temperature Maximum

°C

288

Heat Capacity

J/g°C

1.12

Electrical Properties

Units

Tlam SS HTD03

Dielectric Constant @ 1KHz/1MHz

5.1/4.9

Dissipation Factor @ 1KHz

0.007

Volume Resistivity @ 25°C

ohm-cm

1.4E+15

Volume Resistivity @ 150°C

ohm-cm

2.0E+11

Surface Resistivity

ohm

1.5E+12

Dielectric Strength

VAC/mil(kVAC/mm)

600(23.6)

Withstand Voltage (DC)

VDC

1800

Mechanical Properties

Units

Tlam SS HTD03

Dielectric Thickness

inch (mm)

0.003(0.076)

Peel Strength

lbs/in (Kg/cm)

5(0.9)

CTE < Tg XY/Z axis

ppm/°C

16/36

CTE > Tg XY/Z axis

ppm/°C

18/155

Young’s Modulus @ 25/150°C

MPa

13180/6810

Poisson’s Ratio 25/150°C

0.277/0.263

Flexural Strength 25°C

MPa

142

Mechanical Properties

Units

Tlam SS HTD03

UL Continuous Operating Temp

°C

150

UL Flammability

E165095

94V0

Comparative Tracking Index

600

Solder Float (2mins @ 288°C)

pass

All properties are typical @ 25°C, unless otherwise specified.

For design engineer guidance only, observed performance varies in application.

Engineers are reminded to test the material in application.

Peel strength is measured with 1oz Cu weight.

All properties are based on nominal thickness.

The layout and process may require thicker starting Tpreg to meet nominal laminated thickness.