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TMP93CS41DF Arkusz danych(PDF) 43 Page - Toshiba Semiconductor |
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TMP93CS41DF Arkusz danych(HTML) 43 Page - Toshiba Semiconductor |
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43 / 48 page ![]() Quality and Reliability Assurance / Handling Precautions 030901 QUA-43 2002-02-20 4.5.3 Soldering Temperature Profile The soldering temperature and heating time vary from device to device. Therefore, when specifying the mounting conditions, refer to the individual datasheets and databooks for the devices used. (1) Using a Soldering Iron Complete soldering within ten seconds for lead temperatures of up to 260°C, or within three seconds for lead temperatures up to 350°C. (2) Standard Mounting Conditions for SMDs (Surface Mount Devices) For details, refer to section 2.1 Mounting Precautions in chapter 2 Handling Precautions for Microcontrollers. |
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