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L6221 Arkusz danych(PDF) 17 Page - STMicroelectronics |
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L6221 Arkusz danych(HTML) 17 Page - STMicroelectronics |
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17 / 22 page ![]() Mounting instructions 17/22 Figure 25 shows the maximum dissipable power Ptot and the Rth j-amb as a function of the side " α" of two equal square copper areas having a thickness of 35 µm (1.4 mils). During soldering the pins temperature must not exceed 260 °C and the soldering time must not be longer than 12 seconds. The external heat sink or printed circuit copper area must be connected to electrical ground. Figure 25. Maximum dissipable power and junction-to-ambient thermal resistance versus side " α" Figure 26. Maximum allowable power dissipation versus ambient temperature |
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