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SPC56EL70L3 Arkusz danych(PDF) 10 Page - STMicroelectronics |
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SPC56EL70L3 Arkusz danych(HTML) 10 Page - STMicroelectronics |
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10 / 128 page ![]() Introduction SPC56EL70L3, SPC56EL70L5,PC564L70L3, SPC564L70L5 10/128 DocID023953 Rev 5 Modules (cont.) Deserial Serial Peripheral Interface (DSPI) 3 × DSPI as many as 8 chip selects Cyclic Redundancy Checker (CRC) unit Yes Junction temperature sensor (TSENS) Yes, replicated module Digital I/Os 16 Supply Device power supply 3.3 V with integrated bypassable ballast transistor External ballast transistor not needed for bare die Analog reference voltage 3.0 V – 3.6 V and 4.5 V – 5.5 V Clocking Frequency- modulated phase-locked loop (FMPLL) 2 Internal RC oscillator 16 MHz External crystal oscillator 4 – 40 MHz Debug Nexus Level 3+ Package s LQFP 100 pins 144 pins Temperat ure Temperature range (junction) –40 to 150 °C Ambient temperature range using external ballast transistor (LQFP) –40 to 125 °C 1. The third eTimer is not connected to any pins on the package. Its usage is confined internally to the device. 2. The second FlexPWM is not connected to any pins on the package. Its usage is confined internally to the device. Table 1. SPC56XL70/SPC56X64 device summary (continued) Feature SPC56EL64 SPC56EL70 SPC564L64 SPC564L70 |
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