STM8S003F3 datasheet(92/104 Pages) STMICROELECTRONICS

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STM8S003F3 Arkusz danych(PDF) 92 Page - STMicroelectronics

Numer części	STM8S003F3

Szczegółowy opis	Extended instruction set

PDF	104 Pages

Scroll/Zoom	100%

Producent	STMICROELECTRONICS [STMicroelectronics]

Strona internetowa	http://www.st.com

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92 / 104 page

Package information

STM8S003F3 STM8S003K3

92/104

DocID018576 Rev 9

Figure 48. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,

package footprint

1. Dimensions are expressed in millimeters.

0°

8°

0°

8°

aaa

0.100

0.0039

1. Values in inches are converted from mm and rounded to four decimal digits.

2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs

shall not exceed 0.15mm per side.

3. Dimension "E1" does not include interlead flash or protrusions. Interlead flash or protrusions shall not

exceed 0.25mm per side.

Table 53. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,

package mechanical data

Symbol

millimeters

inches(1)

Min.

Typ.

Max.

Min.

Typ.

Max.

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