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STM8SPLNB1 Arkusz danych(PDF) 31 Page - STMicroelectronics |
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STM8SPLNB1 Arkusz danych(HTML) 31 Page - STMicroelectronics |
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31 / 44 page ![]() DocID018831 Rev 5 31/44 STM8SPLNB1 Package information 43 Figure 14. TSSOP20 recommended footprint k 0.0° - 8.0° 0.0° - 8.0° aaa 0.100 0.0039 1. Values in inches are converted from mm and rounded to 4 decimal digits 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per side. 3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. Table 31. 20-pin, 4.40 mm body, 0.65 mm pitch mechanical data (continued) Dim. mm inches(1) Min Typ Max Min Typ Max |
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