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STM32F100XC Arkusz danych(PDF) 49 Page - STMicroelectronics |
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STM32F100XC Arkusz danych(HTML) 49 Page - STMicroelectronics |
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49 / 106 page ![]() DocID15081 Rev 10 49/106 STM32F100xC, STM32F100xD, STM32F100xE Electrical characteristics 105 5.3.6 External clock source characteristics High-speed external user clock generated from an external source The characteristics given in Table 20 result from tests performed using an high-speed external clock source, and under the ambient temperature and supply voltage conditions summarized in Table 9. APB2 (up to 24 MHz) APB2-Bridge 4.17 µA/MHz GPIOA 6.67 GPIOB 6.25 GPIOC 6.67 GPIOD 6.67 GPIOE 6.67 GPIOF 5.42 GPIOG 6.67 SPI1 4.17 USART1 12.08 TIM1 22.08 TIM15 14.17 TIM16 10.00 TIM17 10.00 ADC1(3) 15.83 1. The BusMatrix is automatically active when at least one master is ON.(CPU, DMA1 or DMA2). 2. When DAC_OUT1 or DAC_OUT2 is enabled, there is an additional current consumption equal to 0,42 mA 3. Specific conditions for measuring ADC current consumption: fHCLK = 24 MHz, fAPB1 = fHCLK, fAPB2 = fHCLK, fADCCLK = fAPB2/2. When ADON bit in the ADC_CR2 register is set to 1, a current consumption of analog part equal to 0.82 mA must be added. Table 19. Peripheral current consumption (continued) Peripheral Typical consumption at 25 °C Unit |
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