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STM32L162VC Arkusz danych(PDF) 112 Page - STMicroelectronics |
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STM32L162VC Arkusz danych(HTML) 112 Page - STMicroelectronics |
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112 / 123 page ![]() Package information STM32L162VC, STM32L162RC 112/123 DocID022881 Rev 10 Figure 36. UFBGA100, 7 x 7 mm, 0.5 mm pitch, package recommended footprint eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 69. UFBGA100, 7 x 7 mm, 0.50 mm pitch, recommended PCB design rules Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 68. UFBGA100, 7 x 7 mm, 0.5 mm pitch package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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