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STA333SML Arkusz danych(PDF) 15 Page - STMicroelectronics |
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STA333SML Arkusz danych(HTML) 15 Page - STMicroelectronics |
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15 / 17 page ![]() DocID025317 Rev 2 15/17 STA333SML Package mechanical data 17 4.1 Soldering information Figure 11. Recommended soldering reflow profile for mounting on PCB Table 9. Recommended soldering reflow values for mounting on PCB Profile Typ. Max. Temp. gradient in preheat (T = 70 - 180 °C) 0.9 °C/s 3 °C/s Temp.gradient (T = 200 - 225 °C) 2 °C/s 3 °C/s Peak temp. in reflow 240 - 245 °C 260 °C Time above 220 °C 60 s 90 s Temp. gradient in cooling -2 to -3 °C -6 °C Time from 50 to 220 °C 160 to 220 s |
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