HSP061-4F4 datasheet(4/7 Pages) STMICROELECTRONICS

Numer części	HSP061-4F4

Szczegółowy opis	4-line ESD protection for high speed lines

PDF	7 Pages

Scroll/Zoom	100%

Producent	STMICROELECTRONICS [STMicroelectronics]

Strona internetowa	http://www.st.com

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4 / 7 page

Package information

HSP061-4F4

4/7

DocID022207 Rev 2

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 9. Flip Chip dimensions

300 µm ±40

Ø 140 µm ±15

380 µm ±20

100 µm ±15

1200 µm ±50

Figure 10. Footprint recommendations

(dimensions in mm)

Figure 11. Marking

130 µm recommended

170 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

230 µm minimum

Dot,

xx = marking

yww = datecode

y = year,

ww = week

z = manufacturing

location

HSP061-4F4 Arkusz danych(PDF) 4 Page - STMicroelectronics