STPS30H60C

Package mechanical data

9/11

Figure 13.

Footprint (dimensions in millimeters)

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 8.

REF.

DIMENSIONS

Millimeters

Inches

Min.

Max

Min.

Max.

A

4.40

4.60

0.173

0.181

A1

2.49

2.69

0.098

0.106

A2

0.03

0.23

0.001

0.009

B

0.70

0.93

0.027

0.037

B2

1.14

1.70

0.045

0.067

C

0.45

0.60

0.017

0.024

C2

1.23

1.36

0.048

0.054

D

8.95

9.35

0.352

0.368

E

10.00

10.40

0.393

0.409

G

4.88

5.28

0.192

0.208

L

15.00

15.85

0.590

0.624

L2

1.27

1.40

0.050

0.055

L3

1.40

1.75

0.055

0.069

M

2.40

3.20

0.094

0.126

R

0.40 typ.

0.016 typ.

V2

0°

8°

0°

8°

G

L

L3

L2

B

B2

E

* FLAT ZONE NO LESS THAN 2mm

A

C2

D

R

A2

M

V2

C

A1

*

16.90

10.30

8.90

3.70

5.08

1.30