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SW15P02 Arkusz danych(PDF) 1 Page - Xian Semipower Electronic Technology Co., Ltd. |
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SW15P02 Arkusz danych(HTML) 1 Page - Xian Semipower Electronic Technology Co., Ltd. |
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1 / 7 page ![]() Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved. Mar. 2017. Rev. 3.0 1/7 SW15P02 P-channel Enhanced mode TO-251/TO-252/DFN3*3/DFN5*6 MOSFET Absolute maximum ratings Symbol Parameter Value Unit TO-251 TO-252 DFN3*3 DFN5*6 V DSS Drain to source voltage -20 V I D Continuous drain current (@T C=25 oC) -15* A Continuous drain current (@T C=100 oC) -9.5* A I DM Drain current pulsed (note 1) -60 A V GS Gate to source voltage ± 12 V dv/dt Peak diode recovery dv/dt (note 3) 5 V/ns P D Total power dissipation (@T C=25 oC) 69.4 62.5 W Total power dissipation (@Ta=25oC) 1.5 3.3 W Derating factor above 25oC 0.6 0.5 0.01 0.03 W/oC T STG, TJ Operating junction temperature & storage temperature -55 ~ + 150 oC T L Maximum lead temperature for soldering purpose, 1/8 from case for 5 seconds. 300 oC Thermal characteristics Symbol Parameter Value Unit TO-251 TO-252 DFN3*3 DFN5*6 R thjc Thermal resistance, Junction to case 1.8 2 oC/W R thja Thermal resistance, Junction to ambient 62 81 38 oC/W *. Drain current is limited by junction temperature. BV DSS : -20V I D : -15A R DS(ON) : 9.4mΩ @VGS=-4.5V 8.1m Ω @V GS=-10V TO251/252:1. Gate 2. Drain 3. Source DFN3*3&DFN5*6:4.Gate 5,6,7,8.Drain 1,2,3.Source Order Codes Item Sales Type Marking Package Packaging 1 SW I 15P02 SW15P02 TO-251 TUBE 2 SW D 15P02 SW15P02 TO-252 REEL 3 SW H 15P02 SW15P02 DFN3*3 REEL 4 SW HA 15P02 SW15P02 DFN5*6 REEL Features High ruggedness Low R DS(ON) (Typ 9.4mΩ)@VGS=-4.5V Low R DS(ON) (Typ 8.1mΩ)@VGS=-10V Low Gate Charge (Typ 91nC) Improved dv/dt Capability 100% Avalanche Tested Application: DC-DC Converter, Motor Control General Description This power MOSFET is produced with advanced technology of SAMWIN. This technology enable the power MOSFET to have better characteristics, including Fast switching time, low on resistance, low gate charge and especially excellent Avalanche characteristics. TO-252 1 2 3 TO-251 1 2 3 DFN3*3 DFN5*6 G(4) D(5,6,7,8) S(1,2,3) Note: R thja is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is d efined as the solder mounting surface of the drain pins. R thjc is guaranteed by design while Rthca is determined by the user‘s board design. DFN3*3 R thja 81 oC/W & DFN5*6 R thja 38 oC/W on a 1 in2 pad of 2oz copper. |
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