MCT2, MCT2E

OPTOCOUPLERS

SOES023 – MARCH 1983 – REVISED OCTOBER 1995

5

POST OFFICE BOX 655303

MECHANICAL INFORMATION

The package consists of a gallium-arsenide infrared-emitting diode and an npn silicon phototransistor mounted

on a 6-lead frame encapsulated within an electrically nonconductive plastic compound. The case can withstand

soldering temperature with no deformation and device performance characteristics remain stable when

operated in high-humidity conditions. Unit weight is approximately 0.52 grams.

C

L

C

0,534 (0.021)

0,381 (0.015)

6 Places

Seating Plane

L

7,62 (0.300) T.P.

6,61 (0.260)

6,09 (0.240)

0,305 (0.012)

0,203 (0.008)

3,81 (0.150)

3,17 (0.125)

5,46 (0.215)

2,92 (0.115)

1,78 (0.070)

0,51 (0.020)

2,29 (0.090)

1,27 (0.050)

2,54 (0.100) T.P.

(see Note A)

1,01 (0.040) MIN

1,78 (0.070) MAX

6 Places

9,40 (0.370)

8,38 (0.330)

Index Dot

(see Note B)

105

°

90

°

1

2

3

6

5

4

(see Note C)

NOTES: A. Leads are within 0,13 (0.005) radius of true position (T.P.) with maximum material condition and unit installed.

B. Pin 1 identified by index dot.

C. Terminal connections:

1. Anode (part of the infrared-emitting diode)

2. Cathode (part of the infrared-emitting diode)

3. No internal connection

4. Emitter (part of the phototransistor)

5. Collector (part of the phototransistor)

6. Base (part of the phototransistor)

D. The dimensions given fall within JEDEC MO-001 AM dimensions.

E. All linear dimensions are given in millimeters and parenthetically given in inches.

Figure 5. Mechanical Information