CYStech Electronics Corp.

Spec. No. : C179SP

Issued Date : 2017.08.23

Revised Date :

Page No. : 6/6

DISP0165CTSP

CYStek Product Specification

TO-277 Dimension

Millimeters

Inches

Millimeters

Inches

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

1.05

1.15

0.041

0.045

D2

2.95

3.15

0.116

0.124

b1

0.80

0.99

0.031

0.039

E

6.40

6.60

0.252

0.260

b2

1.70

1.88

0.067

0.074

E1

5.30

5.45

0.209

0.215

b3

0.15

0.35

0.006

0.014

E2

3.45

3.65

0.136

0.144

C

0.20

0.33

0.008

0.013

E3

4.20

4.60

0.165

0.181

D

4.00

4.30

0.157

0.169

e

1.84 TYP

0.072 TYP

D1

3.90

4.05

0.154

0.159

L

0.75

0.95

0.030

0.037

2.Lead thickness specified per L/F drawing with solder plating.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Marking:

Date

Code

DISP

0165CT

□□

3-Lead TO-277 Plastic

Surface Mounted Package

CYStek Package Code: SP

Style: Pin 1.Cathode 2.Anode 3.Cathode