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CASR-50-NP Arkusz danych(PDF) 21 Page - LEM |
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CASR-50-NP Arkusz danych(HTML) 21 Page - LEM |
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21 / 24 page ![]() 21 PCB footprint: * = Pad design according to IPC 2222, IPC 2221 Assembly on PCB Recommended PCB hole diameter 1.3 mm for primary pin 0.8 mm for secondary pin Maximum PCB thickness 2.4 mm Wave soldering profile maximum 260°C for 10 s No clean process only. Safety m This transducer must be used in electric/electronic equipment with respect to applicable standards and safety requirements in accordance with the manufacturer’s operating instructions c Caution, risk of electrical shock When operating the transducer, certain parts of the module can carry hazardous voltage (eg. primary busbar, power supply). Ignoring this warning can lead to injury and/or cause serious damage. This transducer is a built-in device, whose conducting parts must be inaccessible after installation. A protective housing or additional shield could be used. Main supply must be able to be disconnected. PCB footprints Dimensions in mm. 1 mm = 0.034 inches PCB footprint: * = Pad design according to IPC 2222, IPC 2221 PCB footprint: * = Pad design according to IPC 2222, IPC 2221 CAS Series CASR Series CKSR Series |
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