G950 datasheet(2/10 Pages) ETC

2 / 10 page

Ver: 1.6

Dec 31, 2002

TEL: 886-3-5788833

http://www.gmt.com.tw

G950

Global Mixed-mode Technology Inc.

Absolute Maximum Ratings

(Note 1)

Input Voltage……………………………………..…..…7V

Power Dissipation Internally Limited ….

(Note 2)

Maximum Junction Temperature…..…………… …..150°C

Storage Temperature Range….…..-65°C

≤ TJ ≤+150°C

Lead Temperature, Time for Wave Soldering

TO 220 Package………………………………260°C, 10s

TO 252, TO 263, SOT 223 Package…….…...260°C, 4s

Continuous Power Dissipation (TA = + 25°C)

SOT 223

(1)……………………….….……….………..0.8W

TO 252

(1)………..……………….……….….………..1.0W

TO 263

(1)………..……………….……….….………..1.6W

Note (1): See Recommended Minimum Footprint.

Operating Conditions

(Note 1)

Input Voltage…………………………………….3.3V~6V

Temperature Range……………………0°C

≤ TJ ≤125°C

Electrical Characteristics

VIN =5V, IO = 1A, CIN = 1µF, COUT =10 µF, All specifications apply for TA = TJ = 25°C. [Note 3]

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

VIN = 5V, 10mA < IO < 1A

Output Voltage

VIN = 3.3V, 10mA < IO < 500mA

2.475

2.50

2.575

Line Regulation

3.3V < VIN < 6V, IO = 10mA

VIN = 5V, 10mA < IO < 1A

Load Regulation

VIN = 3.3V, 10mA < IO < 500mA

Output Impedance

200mA DC and 100mA AC, fo = 120Hz

Ω

Quiescent Current

VIN = 5V

0.6

Ripple Rejection

fi = 120Hz,Vripple =2VP-P, Io = 100mA

IO = 1A

1.15

IO = 500mA

420

Dropout Voltage

IO = 100mA

200

Short Circuit Current

1.6

Over Temperature

150

°C

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating

Conditions are conditions under which the device functions but the specifications might not be guaranteed. For

guaranteed specifications and test conditions see the Electrical Characteristics.

Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal re-

sistance,

θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient tem-

perature is Tjmax-TA /

θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC

will go into thermal shutdown. For the G950 in SOT 223 package,

θJA is 156°C/W; in TO 263 package, θJA

is 75°C/W, and in the TO 252 package,

θJA is 125°C/W (See recommend minimum footprint). The safe

operation in SOT 223,TO 252 & TO 263 package, it can see “Typical Performance Characteristics” (Safe

Operating Area).

Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.

Note4: The type of output capacitor should be tantalum or aluminum.

Definitions

Dropout Voltage

The input/output Voltage differential at which the

regulator output no longer maintains regulation against

further reductions in input voltage. Measured when the

output drops 100mV below its nominal value. Dropout

voltage is affected by junction temperature, load cur-

rent and minimum input supply requirements.

Line Regulation

The change in output voltage for a change in input

voltage. The measurement is made under conditions

of low dissipation or by using pulse techniques such

that average chip temperature is not significantly af-

fected.

Load Regulation

The change in output voltage for a change in load

current at constant chip temperature. The measure-

ment is made under conditions of low dissipation or by

using pulse techniques such that average chip tem-

perature is not significantly affected.

Maximum Power Dissipation

The maximum total device dissipation for which the

regulator will operate within specifications.

Quiescent Bias Current

Current which is used to operate the regulator chip

and is not delivered to the load.

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