Source and Shink 1.5A/2A Fast Transient

Response Line Regulator

EC2960

Page 11 of 13

4H19N-Rev.F00F

Application Information

Power Sequencing

The input sequence of powers applied for VIN and VCNTL

is not necessary to be concerned.

Reference Voltage

A reference voltage is applied at the VREF pin by a resistor

divider between VIN and GND pins. An external bypass

capacitor is also connected to VREF. The capacitor and the

resistor divider form a low-pass filter to reduce the inherent

reference noise from VIN.

The capacitor is a 0.1uF or greater ceramic capacitor and

connected as close to VREF as possible. More capacitance

and large resistor divider will increase the soft-start interval.

Do not place any additional loading on this reference input

pin.

Input Capacitor

The EC2960/EC2960A requires proper input capacitors to

supply current surge during stepping load transients to

prevent the input rail from dropping. Because the parasitic

inductors from the voltage sources or other bulk capacitors

to the VIN pin limit the slew rate of the input current, more

parasitic inductance needs more input capacitance.

For the EC2960, the total capacitance of input capacitors

value including MLCC and aluminum electrolytic capacitors

should be larger than 10uF. For VCNTL pin, a capacitor

of 0.47uF (MLCC) or above is recommended for noise

decoupling.

Output Capacitor

The EC2960/EC2960A needs a proper output capacitor to

maintain circuit stability and improve transient response. In

order to insure the circuit stability, a 10uF X5R or X7R

MLCC output capacitor is sufficient at all operating

temperatures and it must be placed near the VOUT. The

maximum distance from output capacitor to VOUT must

within 10mm. Total output capacitors value including

MLCC and aluminum electrolytic capacitors should be

larger than 10uF

Table 1 provides the suitable output capacitors for EC2960

Operation Region and Power Dissipation

The EC2960/EC2960A maximum power dissipation depends on

the thermal resistance and temperature difference between the

die junction and ambient air. The power dissipation PD across

the device is:

the maximum power dissipation is calculated as: