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AD9225ARSZRL Arkusz danych(PDF) 21 Page - Analog Devices |
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AD9225ARSZRL Arkusz danych(HTML) 21 Page - Analog Devices |
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21 / 26 page ![]() –20– AD9225 AIN (dBFS) 90 95 –15 0 –10 –5 85 70 55 50 100 80 75 65 60 SFDR DUAL-TONE (dBFS) SNR SINGLE-TONE (dBc) SFDR SINGLE-TONE (dBFS) Figure 29. IF Undersampling at 70 MHz (F1 = 69.50 MHz, F2 = 70.11 MHz, CLOCK = 25 MHz) AIN (dBFS) 90 95 –15 0 –10 –5 85 70 55 50 100 80 75 65 60 SFDR DUAL-TONE (dBFS) SNR SINGLE-TONE (dBc) SFDR SINGLE-TONE (dBFS) Figure 30. IF Undersampling at 85 MHz (F1 = 84.81 MHz, F2 = 85.23 MHz, CLOCK = 20 MHz) GROUNDING AND DECOUPLING Analog and Digital Grounding Proper grounding is essential in any high speed, high resolution system. Multilayer printed circuit boards (PCBs) are recom- mended to provide optimal grounding and power schemes. The use of ground and power planes offers distinct advantages: •The minimization of the loop area encompassed by a signal and its return path. •The minimization of the impedance associated with ground and power paths. •The inherent distributed capacitor formed by the power plane, PCB insulation and ground plane. These characteristics result in both a reduction of electro- magnetic interference (EMI) and an overall improvement in performance. It is important to design a layout that prevents noise from cou- pling onto the input signal. Digital signals should not be run in parallel with input signal traces and should be routed away from the input circuitry. While the AD9225 features separate analog and driver ground pins, it should be treated as an analog com- ponent. The AVSS and DRVSS pins must be joined together directly under the AD9225. A solid ground plane under the ADC is acceptable if the power and ground return currents are carefully managed. Alternatively, the ground plane under the ADC may contain serrations to steer currents in predictable directions where cross coupling between analog and digital would otherwise be unavoidable. The AD9225/AD9225EB ground layout, shown in Figure 38, depicts the serrated type of arrangement. The board is built primarily over a common ground plane. It has a slit to route currents near the clock driver. Figure 31 illus- trates a general scheme of ground and power implementation, in and around the AD9225. ANALOG CIRCUITS DIGITAL LOGIC ICs V A A D DVSS AVSS A B IA ID AVDD DVDD LOGIC SUPPLY D A VIN CSTRAY CSTRAY GND A = ANALOG D = DIGITAL ADC IC DIGITAL CIRCUITS A A Figure 31. Ground and Power Consideration Analog and Digital Driver Supply Decoupling The AD9225 features separate analog and driver supply and ground pins, helping to minimize digital corruption of sensitive analog signals. In general, AVDD, the analog supply, should be decoupled to AVSS, the analog common, as close to the chip as physically possible. Figure 32 shows the recommended decoupling for the analog supplies; 0.1 mF ceramic chip and 10 mF tantalum capacitors should provide adequately low imped- ance over a wide frequency range. Note that the AVDD and AVSS pins are co-located on the AD9225 to simplify the layout of the decoupling capacitors and provide the shortest possible PCB trace lengths. The AD9225/AD9225EB power plane layout, shown in Figure 39 depicts a typical arrangement using a multi- layer PCB. 0.1 F AVDD AVSS AD9225 10 F Figure 32. Analog Supply Decoupling The CML is an internal analog bias point used internally by the AD9225. This pin must be decoupled with at least a 0.1 mF capacitor as shown in Figure 33. The dc level of CML is approximately AVDD/2. This voltage should be buffered if it is to be used for any external biasing. 0.1 F CML AD9225 Figure 33. CML Decoupling Rev. C |
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