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L4962/A Arkusz danych(PDF) 12 Page - STMicroelectronics |
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L4962/A Arkusz danych(HTML) 12 Page - STMicroelectronics |
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12 / 15 page ![]() 12/15 MOUNTING INSTRUCTION The Rth-j-amb of the L4962 can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Fig. 32). The diagram of figure 33 shows the Rth-j-amb as a function of the side ”l” of two equal square copper areas having the thickness of 35 µ (1.4 mils). During soldering the pins temperature must not exceed 260 °C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper are must be connected to electrical ground. Figure 32. Example of P.C. board copper area which is used as heatsink Figure 33. Maximum dissipable power and junction to ambient thermal resistance vs. side ”l” L4962 |
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