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DISN0165SP Arkusz danych(PDF) 2 Page - Cystech Electonics Corp. |
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DISN0165SP Arkusz danych(HTML) 2 Page - Cystech Electonics Corp. |
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2 / 7 page ![]() CYStech Electronics Corp. Spec. No. : C211SP Issued Date : 2017.11.08 Revised Date : Page No. : 2/7 DISN0165SP Preliminary CYStek Product Specification Absolute Maximum Ratings (TA=25℃, unless otherwise noted) Parameters Conditions Symbol Value Units Repetitive peak reverse voltage VRRM 650 V RMS voltage VRMS 455 V Continuous reverse voltage VR 650 V Forward rectified current Single phase half wave, 60Hz @TJ=25°C IF(AV) 1 A Repetitive Peak Forward Current Single phase half wave, 60Hz @TJ=25°C IFRM 1.57 A Forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC method) IFSM 14 A Maximum reverse recovery time IF=1A, dIF/dt=100A/μs trr 1 μs Storage temperature range Tstg -55~+150 C Operating junction temperature range Tj -55~+150 C Thermal Data Parameter Symbol Value Unit Thermal Resistance, Junction-to-case, max Rth,j-c 12.5 C/W Thermal Resistance, Junction-to-ambient, max (Note 1 ) Rth,j-a 39 Thermal Resistance, Junction-to-ambient, max (Note 2 ) 75 Thermal Resistance, Junction-to-ambient, max (Note 3) 169 Power Dissipation @ TC=25°C PD 10 W Power Dissipation @ TA=25°C (Note 1 ) 3.2 Power Dissipation @ TA=25°C (Note 2 ) 1.7 Power Dissipation @ TA=25°C (Note 3 ) 0.74 Note: 1. Device mounted on FR-4 PCB, single sided 2 oz. copper, pad dimension 50mm×50mm. 2. Device mounted on FR-4 PCB, single sided 1 oz. copper, pad dimension 25mm×25mm. 3. Device mounted on FR-4 PCB, single sided 1 oz. copper, minimum recommended pad dimension. Characteristics (TA=25C, unless otherwise noted) Characteristic Symbol Condition Min. Typ Max. Unit Continuous reverse voltage VR IR=100μA 650 - - V Forward Voltage VF 1 IF=100mA - - 1.1 V VF 2 IF=500mA - - 1.2 Reverse Leakage Current IR VR=540V - - 100 nA VR=540V, TA=125C - - 10 μA Junction Capacitance CJ VR=1V, f=1MHz - 7 - pF |
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