| Producent | Numer części | Arkusz danych | Szczegółowy opis |
Molex Electronics Ltd. |
0010897340
|
433Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 34 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|
|
0010897340
|
28Kb/2P |
2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature
|
|
0010897341
|
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 34 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length
|
|
0010897341
|
28Kb/2P |
2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature
|
|
0010897342
|
28Kb/2P |
2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature
|
|
0010897300
|
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|
|
0010897300
|
28Kb/2P |
2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature,
|
|
0010897301
|
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length
|
|
0010897301
|
28Kb/2P |
2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature
|
|
0010897302
|
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC TailPlating, 2.72mm (.107") PC Tail
|
|
0010897302
|
28Kb/2P |
2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature
|
|
0010897303
|
433Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
|
|
0010897303
|
28Kb/2P |
2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature
|
|
0010897320
|
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 32 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|
|
0010897321
|
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 32 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail
|
|
0010897321
|
28Kb/2P |
2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature
|
|
0010897322
|
433Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 32 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
|
|
0010897360
|
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 36 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|
|
0010897361
|
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 36 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length
|
|
0010897361
|
28Kb/2P |
2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature
|
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