# BCC Bump Chip Carrier

## Features
· Body sizes: 4 x 4mm to 9 x 9mm
· Lead pitch: 0.50mm and 0.80mm
· Custom configurations available
· Package profile height: max 0.80mm
· Single and dual row designs
· Ni/Pd/Au plated bumps
· Enhanced electrical and thermal performance
· JEDEC standard compliant

## Applications
· RF
· Power Management
· Analog/Linear
· Logic
· High-performance, compact designs

## Description
· Chip scale leadframe-based molded package with bumps formed after leadframe etching.
· Exposed die pad for excellent thermal/electrical performance.
· Ideal for high-frequency, high-power applications.
· Manufactured in a molded array format for throughput and material utilization.

## Specifications
· Die Thickness: 279µm nominal, 355µm max.
· Gold Wire: 25µm (1.0mils) diameter
· Lead Finish: Preplated Ni/Pd/Au bumps
· Marking: Laser
· Packing: Tape & reel / JEDEC tray

## Package Configurations

Package Size (mm)	Lead Pitch (mm)	Lead Count
4 x 4	0.80	16
5 x 5	0.50	32
6 x 6	0.50	40
7 x 7	0.50	48 / 84
8 x 8	0.50	56
9 x 9	0.50	116

## Reliability
· Moisture Sensitivity Level: JEDEC Level 2a/2/1 @ 260°C (depending on package)
· Temperature Cycling: -65°C/150°C, 1000 cycles
· High Temp Storage: 150°C, 1000 hrs
· Temp/Humidity Test: 85°C/85% RH, 1000 cycles
· Pressure Cooker Test: 121°C, 100% RH, 2 atm, 168 hrs

## Variants
· BCC+ (no ground ring)
· BCC++ (with ground ring)
· BCCs++ (staggered dual row)
· BCCs+ (staggered dual row)

## Contact Information
· Corporate Office: 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777
· Global Offices: USA, JAPAN, CHINA, MALAYSIA, KOREA, TAIWAN, UK, NETHERLANDS (contact details provided in the document)