The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks

of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information

will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.

STATS ChipPAC reserves the right to change the information at any time and without notice.

©Copyright 2006. STATS ChipPAC Ltd. All rights reserved.

May 2006

Corporate Office

10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823

Global Offices

USA 510-979-8000

JAPAN 81-3-5789-5850

CHINA 86-21-5976-5858

MALAYSIA 603-4257-6222

KOREA 82-31-639-8911

TAIWAN 886-3-593-6565

UK 44-1483-413-700

NETHERLANDS 31-38-333-2023

BCC

Bump Chip Carrier

SPECIFICATIONS

Die Thickness

279

µm nominal, 355µm max.

Gold Wire

25

µm (1.0mils) diameter

Lead Finish

Preplated Ni/Pd/Au bumps

Marking

Laser

Packing Options

Tape & reel / JEDEC tray

RELIABILITY

Moisture Sensitivity Level

JEDEC Level 2a/2/1@260°C

(depending upon package)

Temperature Cycling

-65°C/150°C, 1000 cycles

High Temp Storage

150°C, 1000 hrs

Temp / Humidity Test

85°C/85% RH, 1000 cycles

Pressure Cooker Test

121°C, 100% RH, 2 atm,

168 hrs

CROSS-SECTIONS

PACKAGE CONFIGURATIONS

Package Size

Lead Pitch

Lead Count

(mm)

(mm)

4 x 4

0.80

16

5 x 5

0.50

32

6 x 6

0.50

40

7 x 7

0.50

48 / 84

8 x 8

0.50

56

9 x 9

0.50

11 6

BCC+

BCC++

BCCs++

BCCs+