TSSOP Arkusz danych(PDF) - Amkor Technology

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TSSOP Arkusz danych (PDF) - Amkor Technology

TSSOP Datasheet PDF - Amkor Technology


Numer części	TSSOP

Pobierz	TSSOP Pobierz

Rozmiar pliku	502.24 Kbytes

Page	2 Pages

Producent	AMKOR [Amkor Technology]

Strona internetowa	http://www.amkor.com

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Szczegółowy opis

TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages

TSSOP Datasheet (PDF)

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Pobierz Arkusz danych

TSSOP Datasheet PDF - Amkor Technology


Numer części	TSSOP

Pobierz	TSSOP Click to download

Rozmiar pliku	502.24 Kbytes

Page	2 Pages

Producent	AMKOR [Amkor Technology]

Strona internetowa	http://www.amkor.com

Logo

Szczegółowy opis	TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages

TSSOP Arkusz danych (HTML) - Amkor Technology

TSSOP Datasheet HTML 1Page - Amkor Technology

TSSOP Datasheet HTML 2Page - Amkor Technology

TSSOP Szczegóły Produktu

FEATURES
Cu wire interconnect for lowest cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
Available in ExposedPad configuration (Ref: DS571)
Green materials are standard – Pb-free and RoHS compliant
Stealth dicing (narrow saw streets)
Larger/Higher density leadframe strips
Leadframe roughening for improved MSL capability

Podobny numer części - TSSOP

Producent	Numer części	Arkusz danych	Szczegółowy opis
Amkor Technology	TSSOP	780Kb / 3P	ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based 12/21
Amkor Technology	TSSOP	411Kb / 2P	Silver Wirebonding 02/22
TT Electronics.	TSSOP	562Kb / 4P	Surface Mount TSSOP Resistor Networks 08.21
Diodes Incorporated	TSSOP-14	188Kb / 14P	SUGGESTED PAD LAYOUT Rev 43
Diodes Incorporated	TSSOP-14	404Kb / 27P	SUGGESTED PAD LAYOUT Rev 52

Podobny opis - TSSOP

Producent	Numer części	Arkusz danych	Szczegółowy opis
STMicroelectronics	SSOP24	59Kb / 4P	24-LEAD SHRINK SMALL OUTLINE PACKAGE Nov-2002
National Semiconductor ...	MTD48	62Kb / 1P	48 Lead Molded Thin Shrink Small Outline Package, JEDEC
Intersil Corporation	M24.173B	42Kb / 1P	Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP)
fujitsu semiconductor	FPT-20P-M04	37Kb / 1P	THIN SHRINK SMALL OUTLINE PACKAGE
Amkor Technology	CSSOP	304Kb / 1P	Ceramic Shrink Small Outline Package
ACCUTEK MICROCIRCUIT CO...	AK08D300	68Kb / 2P	Micro Small Outline Package MSOP DIP Adapters
Advanced Power Electron...	AP2306AGEN-HF	101Kb / 4P	Small Outline Package
Advanced Power Electron...	AP2318AGEN-HF	64Kb / 4P	Small Outline Package
Amkor Technology	SSOP	433Kb / 2P	Shrink Small Outline, Quarter-Size Small-Outline Packages
Guangdong Youtai Semico...	LM75B	312Kb / 23P	plastic thin shrink small outline package; 8 leads;

O Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Niniejsze informacje służą wyłącznie celom informacyjnym, nie ponosimy odpowiedzialności za jakiekolwiek straty lub szkody spowodowane przez powyższe informacje.

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