| Producent | Numer części | Arkusz danych | Szczegółowy opis |
 Amkor Technology |
TSSOP
|
780Kb/3P
|
ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based
12/21
|
|
TSSOP
|
411Kb/2P
|
Silver Wirebonding
02/22
|
|
TSSOP
|
502Kb/2P
|
TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages
12/21
|
 TT Electronics. |
TSSOP
|
562Kb/4P
|
Surface Mount TSSOP Resistor Networks
08.21
|
 Diodes Incorporated |
TSSOP-14
|
188Kb/14P
|
SUGGESTED PAD LAYOUT
Rev 43
|
|
TSSOP-14
|
404Kb/27P
|
SUGGESTED PAD LAYOUT
Rev 52
|
 Global Mixed-mode Techn... |
TSSOP-14
|
171Kb/1P
|
Package Outline
|
|
TSSOP-14-EP
|
121Kb/1P
|
Package Outline
|
 International Rectifier |
TSSOP-14PIN
|
19Kb/1P
|
TSSOP Package 14-Pin
|
 Diodes Incorporated |
TSSOP-16
|
404Kb/27P
|
SUGGESTED PAD LAYOUT
Rev 52
|
 Torex Semiconductor |
TSSOP-16
|
205Kb/3P
|
Reference Pattern Layout Dimensions
|
 Global Mixed-mode Techn... |
TSSOP-16
|
113Kb/1P
|
Package Outline
|
 RF Monolithics, Inc |
TSSOP-16
|
138Kb/3P
|
16-Pin Ceramic Case 6.4 X 5.0 mm Nominal Footprint
|
 Global Mixed-mode Techn... |
TSSOP-16-EP
|
244Kb/1P
|
Package Outline
|
 Diodes Incorporated |
TSSOP-16EP
|
404Kb/27P
|
SUGGESTED PAD LAYOUT
Rev 52
|
|
TSSOP-20
|
404Kb/27P
|
SUGGESTED PAD LAYOUT
Rev 52
|
 Global Mixed-mode Techn... |
TSSOP-20
|
114Kb/1P
|
Package Outline
|
 List of Unclassifed Man... |
TSSOP-20
|
56Kb/2P
|
Mechanical Dimensions
|
 Global Mixed-mode Techn... |
TSSOP-20-EP
|
122Kb/1P
|
Package Outline
|
 Diodes Incorporated |
TSSOP-20EP
|
404Kb/27P
|
SUGGESTED PAD LAYOUT
Rev 52
|