MP4033GS datasheet(4/25 Pages) MPS

4 / 25 page

MP4033—PRIMARY-SIDE–CONTROL, OFFLINE LED CONTROLLER WITH PFC

MP4033 Rev. 1.0

www.MonolithicPower.com

10/22/2014

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

PACKAGE REFERENCE

TOP VIEW

COMP

VCC

DAMP

MULT

ZCD

GND

TOP VIEW

COMP

VCC

DAMP

MULT

ZCD

GND

NTC

DIM

TOP VIEW

COMP

VCC

DAMP

MULT

ZCD

GND

NTC

DIM

SOIC8

MSOP10

SOIC14

ABSOLUTE MAXIMUM RATINGS

(1)

Input Voltage VCC ....................... -0.3V to +30V

Low-Side MOSFET Drain to Source Voltage

................................................... -0.7V to +30V

Damp Pin Voltage .................... -0.3V to +16.5V

Other Analog Inputs and Outputs.. -0.3V to 6.5V

ZCD Pin Current ......................... -5mA to +5mA

Continuous Power Dissipation

(TJ = +25°C)

(2)

SOIC8........................................................1.3W

SOIC14....................................................1.45W

MSOP10..................................................0.83W

Junction Temperature.............................. 150°C

Lead Temperature ................................... 260°C

Storage Temperature............... -65°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VCC ........................ 11V to 27V

Operating Junction Temp (TJ). . -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8 ................................... 96 ...... 45...

°C/W

MSOP10 .............................. 150 ..... 65...

°C/W

SOIC14 ................................. 86 ...... 38...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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