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IXRFD630 Arkusz danych(PDF) 2 Page - IXYS Corporation

Numer części IXRFD630
Szczegółowy opis  30 A Low-Side RF MOSFET Driver
PDF  8 Pages
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Producent  IXYS [IXYS Corporation]
Strona internetowa  http://www.ixys.com
Logo IXYS - IXYS Corporation

IXRFD630 Arkusz danych(HTML) 2 Page - IXYS Corporation

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30 A Low-Side RF MOSFET Driver
IXRFD630
2
Absolute Maximum Ratings
Electrical Characteristics
Unless otherwise noted, TA = 25° C, 8V < VCC < 30V.
All voltage measurements with respect to GND. IXRFD630 configured as described in Test Conditions.
Symbol
Parameter
Test Conditions
Typ
Max
Units
VIH
High input voltage
VCC = 15V for typical value
3
V
VIL
Low input voltage
VCC = 15V for typical value
2.8
0.8
V
VHYS
Input hysteresis
0.23
V
VIN
Input voltage range
VCC + 0.3
V
IIN
Input current
0V≤ VIN ≤VCC
10
A
VOH
High output voltage
V
VOL
Low output voltage
0.025
V
ROH
High output resistance
VCC = 15V IOUT = 100mA
0.25
ROL
Low output resistance
VCC = 15V IOUT = 100mA
0.17
IPEAK
Peak output current
VCC = 15V
28
A
IDC
Continuous output current
2.5
A
tR
Rise time
VCC=15V CL=1nF
CL=2nF
4
5
ns
ns
tF
Fall time
VCC =15V CL=1nF
CL=2nF
4
5.5
ns
ns
tONDLY
ON propagation delay
VCC =15V CL=2nF
24
ns
tOFFDLY
OFF propagation delay
VCC =15V CL=2nF
22
ns
PWmin
Minimum pulse width
FWHM VCC =15V CL=1nF
8
ns
VCC
Power supply voltage
Recommended
8
15
18
V
ICC
Power supply current
VCC = 15V, VIN = 0V
VCC = 15V, VIN = 3.5V
VCC = 15V, VIN = VCC
0
1
0
1
3
5
mA
mA
mA
3.5
-5
-10
VCC - 0.025
Min
Parameter
Value
Supply Voltage VCC
30V
All Other Pins
-0.3V to VCC +0.3V
Power Dissipation
TA (AMBIENT) ≤ 25C
TC (CASE) ≤ 25C
2W
100W
Storage Temperature
-40°C to 150°C
Soldering Lead Temperature
(10 seconds maximum)
300°C
Input Voltage Level VIN
-5V to VCC + 0.3V
Note: Operating the device outside of the “Absolute Maximum Rat-
ings” may cause permanent damage. Typical values indicate condi-
tions for which the device is intended to be functional but do not
guarantee specific performance limits. The guaranteed specifica-
tions apply only for the test conditions listed. Exposure to absolute
maximum conditions for extended periods may impact device reli-
ability.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when handling and
assembling.
Parameter
Value
Maximum Junction Temperature
150° C
Operating Temperature Range
-40° C to 85° C
Thermal Impedance (Junction to Case) RӨJC 0.25° C/W



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