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GD9FS1G8F2AMG Arkusz danych(PDF) 48 Page - GigaDevice Semiconductor (Beijing) Inc.

Numer części GD9FS1G8F2AMG
Szczegółowy opis  Single level cell technology
PDF  55 Pages
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Producent  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
Strona internetowa  http://www.gigadevice.com/
Logo GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD9FS1G8F2AMG Arkusz danych(HTML) 48 Page - GigaDevice Semiconductor (Beijing) Inc.

Back Button GD9FS1G8F2AMG Datasheet HTML 44Page - GigaDevice Semiconductor (Beijing) Inc. GD9FS1G8F2AMG Datasheet HTML 45Page - GigaDevice Semiconductor (Beijing) Inc. GD9FS1G8F2AMG Datasheet HTML 46Page - GigaDevice Semiconductor (Beijing) Inc. GD9FS1G8F2AMG Datasheet HTML 47Page - GigaDevice Semiconductor (Beijing) Inc. GD9FS1G8F2AMG Datasheet HTML 48Page - GigaDevice Semiconductor (Beijing) Inc. GD9FS1G8F2AMG Datasheet HTML 49Page - GigaDevice Semiconductor (Beijing) Inc. GD9FS1G8F2AMG Datasheet HTML 50Page - GigaDevice Semiconductor (Beijing) Inc. GD9FS1G8F2AMG Datasheet HTML 51Page - GigaDevice Semiconductor (Beijing) Inc. GD9FS1G8F2AMG Datasheet HTML 52Page - GigaDevice Semiconductor (Beijing) Inc. Next Button
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GD9Fx1GxF2A
48
Dimensions
Symbol
A
A1
A2
b
D
Hd
E
E1
e
L
L1
θ
Unit
mm
Min
-
0.05
0.90
0.14
18.30
19.80
11.90
-
0.50
0.425
0.60
0
Nom
-
0.10
1.00
0.22
18.40
20.00
12.00
-
0.525
0.80
-
Max
1.20
0.15
1.10
0.30
18.50
20.20
12.10
12.40
0.625
1.00
7
Note：
1.
Tolerance of the dimension should be ±0.1 unless otherwise specified.
2.
Corner radius should be less than ±0.1R unless otherwise specified (excluding outer lead).
3.
Tolerance of the angles should be ±0.5 degree unless otherwise specified.
4.
The mold surface should have a finish 8±2S without luster.
Trace of knockout pin and the ahaded portion of detail “A” should be polish surface.
5.
Discrepancies between upper and lower molding cavity should be less than 0.05 of the package.
6.
Mold flash should be less than 0.2mm.



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