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CMD158

CMD158

CMD158

6-16 GHz Driver Amplifier

Applications Information

Assembly Guidelines

Assembly Diagram

The backside of the CMD158 is RF ground. Die attach should be accomplished with electrically and

thermally conductive epoxy only. Eutectic attach is not recommended. Standard assembly procedures

should be followed for high frequency devices. The top surface of the semiconductor should be made

planar to the adjacent RF transmission lines, and the RF decoupling capacitors placed in close proximity

to the DC connections on chip.

RF connections should be made as short as possible to reduce the inductive effect of the bond wire. Use

of a 0.8 mil thermosonic wedge bonding is highly recommended as the loop height will be minimized.

The RF input and output require a double bond wire as shown.

The semiconductor is 85 um thick and should be handled by the sides of the die or with a custom collet.

Do not make contact directly with the die surface as this will damage the monolithic circuitry. Handle

with care.

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions

should be observed during handling, assembly and test.

100 pF CHIP CAP

100,000 pF CHIP CAP

to Vdd

RF out

RF in

ver 1.1 0516