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RA32E1-RUT-FR Arkusz danych(PDF) 17 Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

Numer części RA32E1-RUT-FR
Szczegółowy opis  This production use the PLCC-2 package竊똮utline size 2.8*3.5*0.65mm
PDF  20 Pages
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Producent  REFOND [SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.]
Strona internetowa  http://www.refond.com/
Logo REFOND - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

RA32E1-RUT-FR Arkusz danych(HTML) 17 Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

Back Button RA32E1-RUT-FR Datasheet HTML 12Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 13Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 14Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 15Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 16Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 17Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 18Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 19Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RA32E1-RUT-FR Datasheet HTML 20Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.  
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Tel: +86-755-66839118
Fax:+86-755-66839300
E-mail:uvsales@refond.com
W
eb: www.refonduv.com
PAGE:17
REFOND:WI-E-045
A/3
REV:E/3
TG-201709070731NP
Fig 4-1 Operate Method
(5) In designing a circuit, the current through each LED can not exceed the absolute maximum rating specified
for each LED. In the meanwhile,resistors for protection should be applied, otherwise slight voltage shift will
cause big current change,burn out may happen. The driving circuit must be designed to allow forward voltage
only when it is ON or OFF.If the reverse voltage is applied to LED, migration can be generated resulting in LED
damage.
(6) Thermal Design is paramount importance because heat generation may result in the Characteristics
decline,such as brightness decreased,Color change and so on.Please consider the heat generation of the
LEDs when making the system design.LED
(7) Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract
dust, requiring special care during processing. In cases where a minimal level of dirt and dust particles cannot
be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components.
Refond suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that
these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic
cleaning may cause damage to the LED.



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